发明授权
- 专利标题： Semiconductor device including a magnetic sensor chip
- 专利标题（中）： 包括磁传感器芯片的半导体装置
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申请号： US12469512申请日： 2009-05-20
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公开(公告)号： US08362579B2公开(公告)日： 2013-01-29
- 发明人: Horst Theuss , Klaus Elian , Martin Petz
- 申请人： Horst Theuss , Klaus Elian , Martin Petz
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L29/82
- IPC分类号： H01L29/82
摘要：
A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.
公开/授权文献
- US20100295140A1 SEMICONDUCTOR DEVICE 公开/授权日：2010-11-25
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