Invention Grant
- Patent Title: Grounding mechanism and computer system with an multi-directional grounding component
- Patent Title (中): 具有多方向接地元件的接地机构和计算机系统
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Application No.: US12703728Application Date: 2010-02-10
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Publication No.: US08363424B2Publication Date: 2013-01-29
- Inventor: Kun-Hui Lai
- Applicant: Kun-Hui Lai
- Applicant Address: TW Xizhi Dist., New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Xizhi Dist., New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW98221813U 20091123
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K7/18
Abstract:
A grounding mechanism includes a grounding end, and a clip device connected to the grounding end for electrically connecting an electronic device to the grounding end. The clip device includes a first clip for contacting against a lateral side of the electronic device in a first direction so as to ground the electronic device in the first direction, and a second clip for contacting against another side of the electronic device in a second direction different from the first direction so as to ground the electronic device in the second direction.
Public/Granted literature
- US20110120744A1 GROUNDING MECHANISM AND COMPUTER SYSTEM WITH AN MULTI-DIRECTIONAL GROUNDING COMPONENT Public/Granted day:2011-05-26
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