发明授权
- 专利标题: Semiconductor optical interconnection device and semiconductor optical interconnection method
- 专利标题(中): 半导体光互连器件和半导体光互连方法
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申请号: US12919461申请日: 2009-02-10
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公开(公告)号: US08363989B2公开(公告)日: 2013-01-29
- 发明人: Daisuke Okamoto , Kenichi Nishi , Junichi Fujikata , Jun Ushida
- 申请人: Daisuke Okamoto , Kenichi Nishi , Junichi Fujikata , Jun Ushida
- 申请人地址: JP Tokyo
- 专利权人: NEC Corporation
- 当前专利权人: NEC Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-075014 20080324
- 国际申请: PCT/JP2009/052194 WO 20090210
- 国际公布: WO2009/119166 WO 20091001
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; H01L21/02
摘要:
Provided is a semiconductor optical interconnection device capable of transmitting signals between laminated semiconductor chips in a structure where semiconductor chips highly functionalized by being bonded to an optical interconnection chip are laminated. The semiconductor optical interconnection device includes a semiconductor chip 1 and an optical interconnection chip 2. The optical interconnection chip 2 includes an optical element formed thereon (for instance, a photo-sensitive element, a luminous element, or an optical modulator) which has a function relating to signal conversion between light and electricity. The semiconductor chip 1 includes a transmission section 3 (for instance, a coil or an inductor) to transmit signals in a non-contact manner, and a connection section 4 (for instance, a bump) to electrically connect with the optical element.