发明授权
- 专利标题： Heat radiation member for a semiconductor package with a power element and a control circuit
- 专利标题（中）： 具有功率元件和控制电路的半导体封装的散热构件
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申请号： US12960377申请日： 2010-12-03
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公开(公告)号： US08368203B2公开(公告)日： 2013-02-05
- 发明人: Takatoshi Inokuchi , Tadatoshi Asada
- 申请人： Takatoshi Inokuchi , Tadatoshi Asada
- 申请人地址： JP Kariya
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JP Kariya
- 代理机构： Nixon & Vanderhye P.C.
- 优先权： JP2009-276000 20091204
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A semiconductor package includes a metal plate, a power element, a lead frame having a die pad, a resin sheet having insulation properties, a control circuit that controls the power element, and a mold resin. The power element is mounted on the die pad, and the die pad is mounted on the metal plate via the resin sheet. The resin sheet is expanded including at least a lower surface of the die pad while the lower surface of the resin sheet is smaller than an surface of the metal plate, and the control circuit is arranged in a region on the metal plate, which region is other than the region where the power element is arranged.
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