A lithography apparatus with an optical fiber module includes: a light source, a photo mask positioned under the light source, a lens positioned under the photo mask, a wafer stage positioned under the lens for supporting the wafer, wherein the wafer includes a dry film. The lithography apparatus further includes an optical fiber module having a front surface facing away from the lens, wherein a gap is between the front surface and the dry film and the gap is smaller than the wavelength of the light source. The DUV (deep ultraviolet) can pass through the optical fiber module. The present invention features a gap smaller than the wavelength of the light source, creating a near-field effect with improved resolution.