Invention Grant
- Patent Title: Adhesives with mechanical tunable adhesion
- Patent Title (中): 具有机械可调附着力的粘合剂
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Application No.: US12593756Application Date: 2008-03-28
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Publication No.: US08372230B2Publication Date: 2013-02-12
- Inventor: Shu Yang , Pei-chun Lin
- Applicant: Shu Yang , Pei-chun Lin
- Applicant Address: US PA Philadelphia
- Assignee: The Trustees Of The University Of Pennsylvania
- Current Assignee: The Trustees Of The University Of Pennsylvania
- Current Assignee Address: US PA Philadelphia
- Agency: Woodcock Washburn, LLP
- International Application: PCT/US2008/058601 WO 20080328
- International Announcement: WO2008/121784 WO 20081009
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
The invention concerns a method for making an article having a tunable adhesive, said method comprising applying strain to mechanically deform a substrate in at least one direction; applying a rigid coating layer on the substrate; and releasing the strain to form an article having a rippled surface. Ripple characteristics can be altered by mechanical strain in real time which further changes the adhesion properties.
Public/Granted literature
- US20100116430A1 ADHESIVES WITH MECHANICAL TUNABLE ADHESION Public/Granted day:2010-05-13
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