Invention Grant
US08372711B2 Methods of fabricating semiconductor devices with sidewall conductive patterns
有权
制造具有侧壁导电图案的半导体器件的方法
- Patent Title: Methods of fabricating semiconductor devices with sidewall conductive patterns
- Patent Title (中): 制造具有侧壁导电图案的半导体器件的方法
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Application No.: US13110113Application Date: 2011-05-18
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Publication No.: US08372711B2Publication Date: 2013-02-12
- Inventor: Jong-Sun Sel , Jung-Dal Choi , Joon-Hee Lee , Hwa-Kyung Shin
- Applicant: Jong-Sun Sel , Jung-Dal Choi , Joon-Hee Lee , Hwa-Kyung Shin
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2004-0089435 20041104
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A gate pattern is disclosed that includes a semiconductor substrate, a lower conductive pattern, an upper conductive pattern, and a sidewall conductive pattern. The lower conductive pattern is on the substrate. The insulating pattern is on the lower conductive pattern. The upper conductive pattern is on the insulating pattern opposite to the lower conductive pattern. The sidewall conductive pattern is on at least a portion of sidewalls of the upper conductive pattern and the lower conductive pattern. The sidewall conductive pattern electrically connects the upper conductive pattern and the lower conductive pattern. An upper edge portion of the lower conductive pattern may be recessed relative to a lower edge portion of the lower conductive pattern to define a ledge thereon. The sidewall conductive pattern may be directly on the ledge and sidewall of the recessed upper edge portion of the lower conductive pattern.
Public/Granted literature
- US20110217835A1 METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH SIDEWALL CONDUCTIVE PATTERNS Public/Granted day:2011-09-08
Information query
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