Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12501931Application Date: 2009-07-13
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Publication No.: US08373072B2Publication Date: 2013-02-12
- Inventor: Daisuke Iguchi , Kanji Otsuka , Yutaka Akiyama
- Applicant: Daisuke Iguchi , Kanji Otsuka , Yutaka Akiyama
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-184050 20080715
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
A printed circuit board includes a ground layer, a power source layer, a signal wiring layer, an insulating layer and an electromagnetic radiation suppressing member. The power source layer is provided to be opposed to the ground layer. The signal wiring layer transmits a signal in a predetermined frequency domain. The insulating layer insulates the ground layer, the power source layer and the signal wiring layer from one another. The electromagnetic radiation suppressing member is provided to cover a circumferential edge of the insulating layer. The electromagnetic radiation suppressing member has a negative dielectric constant and a positive magnetic permeability in a frequency domain including the predetermined frequency domain.
Public/Granted literature
- US20100013318A1 PRINTED CIRCUIT BOARD Public/Granted day:2010-01-21
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