Invention Grant
- Patent Title: Chip module
- Patent Title (中): 芯片模块
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Application No.: US13076947Application Date: 2011-03-31
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Publication No.: US08373285B2Publication Date: 2013-02-12
- Inventor: Jian-Cheng Chen
- Applicant: Jian-Cheng Chen
- Applicant Address: TW
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW
- Agency: Bacon & Thomas, PLLC
- Priority: TW96133942A 20070911
- Main IPC: H01L23/31
- IPC: H01L23/31
Abstract:
A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a plurality of passive units is assembled on the substrate in the style of encircling the chip. Then, a first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. Then, a second glue structure is filled in the encircled area so that the chip is covered by the second glue structure.
Public/Granted literature
- US20110175240A1 CHIP MODULE Public/Granted day:2011-07-21
Information query
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