Invention Grant
- Patent Title: Web substrate having optimized emboss design
- Patent Title (中): 网板具有优化的压花设计
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Application No.: US13604075Application Date: 2012-09-05
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Publication No.: US08377258B2Publication Date: 2013-02-19
- Inventor: André Mellin , Kevin Benson McNeil , Thomas Timothy Byrne , Jason Merrill Jones
- Applicant: André Mellin , Kevin Benson McNeil , Thomas Timothy Byrne , Jason Merrill Jones
- Applicant Address: US OH Cincinnati
- Assignee: The Procter & Gamble Company
- Current Assignee: The Procter & Gamble Company
- Current Assignee Address: US OH Cincinnati
- Agent Peter D. Meyer
- Main IPC: D21H11/00
- IPC: D21H11/00
Abstract:
A web substrate having at least one embossed ply having a surface thereof is disclosed. The surface has surface area comprising from 0.0 percent to about 1.2 percent dot embossments and from about 10.0 percent to about 20.0 percent line embossments.
Public/Granted literature
- US20120328832A1 WEB SUBSTRATE HAVING OPTIMIZED EMBOSS DESIGN Public/Granted day:2012-12-27
Information query
