Invention Grant
US08377325B2 Etchant for metal wiring and method for manufacturing metal wiring using the same
有权
金属布线用蚀刻剂及使用其的金属布线的制造方法
- Patent Title: Etchant for metal wiring and method for manufacturing metal wiring using the same
- Patent Title (中): 金属布线用蚀刻剂及使用其的金属布线的制造方法
-
Application No.: US13032563Application Date: 2011-02-22
-
Publication No.: US08377325B2Publication Date: 2013-02-19
- Inventor: Nam-Seok Suh , Sun-Young Hong , Jong-Hyun Choung , Bong-Kyun Kim , Hong-Sick Park , Jean-Ho Song , Wang-Woo Lee , Do-Won Kim , Sang-Woo Kim , Won-Guk Seo , Hyun-Cheol Shin , Ki-Beom Lee , Sam-Young Cho
- Applicant: Nam-Seok Suh , Sun-Young Hong , Jong-Hyun Choung , Bong-Kyun Kim , Hong-Sick Park , Jean-Ho Song , Wang-Woo Lee , Do-Won Kim , Sang-Woo Kim , Won-Guk Seo , Hyun-Cheol Shin , Ki-Beom Lee , Sam-Young Cho
- Applicant Address: KR Yongin
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2010-0024250 20100318
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; C25F3/00
Abstract:
Exemplary embodiments of the present invention provide a metal wiring etchant. A metal wiring etchant according to an exemplary embodiment of the present invention includes ammonium persulfate, an organic acid, an ammonium salt, a fluorine-containing compound, a glycol-based compound, and an azole-based compound.
Public/Granted literature
- US20110226727A1 ETCHANT FOR METAL WIRING AND METHOD FOR MANUFACTURING METAL WIRING USING THE SAME Public/Granted day:2011-09-22
Information query
