发明授权
- 专利标题： Light emitting package
- 专利标题（中）： 发光包装
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申请号： US13399709申请日： 2012-02-17
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公开(公告)号： US08378360B2公开(公告)日： 2013-02-19
- 发明人: Jun Seok Park
- 申请人： Jun Seok Park
- 申请人地址： KR Seoul
- 专利权人： LG Innotek Co., Ltd.
- 当前专利权人： LG Innotek Co., Ltd.
- 当前专利权人地址： KR Seoul
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： KR10-2004-0107782 20041217
- 主分类号： H01L29/267
- IPC分类号： H01L29/267
摘要：
The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.
公开/授权文献
- US20120146082A1 LIGHT EMITTING PACKAGE 公开/授权日：2012-06-14
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