发明授权
- 专利标题： Pressure sensor and method of assembling same
- 专利标题（中）： 压力传感器及其组装方法
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申请号： US12960571申请日： 2010-12-06
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公开(公告)号： US08378435B2公开(公告)日： 2013-02-19
- 发明人: Wai Yew Lo , Lan Chu Tan
- 申请人： Wai Yew Lo , Lan Chu Tan
- 代理商 Charles Bergere
- 主分类号： H01L29/82
- IPC分类号： H01L29/82 ; H01L21/00
摘要：
A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid.
公开/授权文献
- US20120139063A1 PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME 公开/授权日：2012-06-07
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