Invention Grant
- Patent Title: Orientation of electronic devices on mis-cut substrates
- Patent Title (中): 电子设备在误切基板上的方向
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Application No.: US12974332Application Date: 2010-12-21
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Publication No.: US08378463B2Publication Date: 2013-02-19
- Inventor: George R. Brandes , Robert P. Vaudo , Xueping Xu
- Applicant: George R. Brandes , Robert P. Vaudo , Xueping Xu
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Hultquist, PLLC
- Agent Steven J. Hultquist; Frank J. Bozzo
- Main IPC: H01L29/04
- IPC: H01L29/04
Abstract:
A microelectronic assembly in which a semiconductor device structure is directionally positioned on an off-axis substrate. In an illustrative implementation, a laser diode is oriented on a GaN substrate wherein the GaN substrate includes a GaN (0001) surface off-cut from the direction predominantly towards either the or the family of directions. For a off-cut substrate, a laser diode cavity may be oriented along the direction parallel to lattice surface steps of the substrate in order to have a cleaved laser facet that is orthogonal to the surface lattice steps. For a off-cut substrate, the laser diode cavity may be oriented along the direction orthogonal to lattice surface steps of the substrate in order to provide a cleaved laser facet that is aligned with the surface lattice steps.
Public/Granted literature
- US20110089536A1 ORIENTATION OF ELECTRONIC DEVICES ON MIS-CUT SUBSTRATES Public/Granted day:2011-04-21
Information query
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