Invention Grant
- Patent Title: Sound enhancement system
- Patent Title (中): 声音增强系统
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Application No.: US12703507Application Date: 2010-02-10
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Publication No.: US08379901B2Publication Date: 2013-02-19
- Inventor: Rajeev Mishra , Maurice N. Leacock , Matthew R. Ford
- Applicant: Rajeev Mishra , Maurice N. Leacock , Matthew R. Ford
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
A speaker assembly mounted on a bracket extending from a ceiling comprises an enclosure that includes a bottom wall, side walls including opposing first and second side walls, a sleeve that receives a tubular member of the bracket, and an interior wall having a first segment that extends from the sleeve to the first side wall and a second segment that extends from the sleeve to the second side wall. The interior wall cooperates with the sleeve to divide the enclosure into two approximately equal sized compartments. Each of the speakers within the assembly either forms, or is mounted in or on, one of the side walls. A top plate is mounted on, and forms a top of, the enclosure and seals the two compartments, the top plate having an opening that is aligned with the sleeve when the top plate is mounted on the enclosure. A power unit and circuitry for the speakers are mounted on the top plate.
Public/Granted literature
- US20100316245A1 Sound Enhancement System Public/Granted day:2010-12-16
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