A mounting structure includes an optoelectronic interconnection module that includes electrical interconnection lines, optical interconnection lines, optical semiconductor device and electrical connection terminals, a mounting board that includes electrical interconnection lines and electrical connection terminals on a main surface and on which the optoelectronic interconnection module is mounted, and a connection member that electrically connects, adheres and fixes the electrical connection terminals and the electrical connection terminals. The optoelectronic interconnection module comprises a circuit area on which the optical semiconductor device is mounted and electrical connection terminals are formed and an interconnection area that is formed in a region other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed, and the electrical connection terminals are formed on the interconnection area side rather than the optical semiconductor device.