Invention Grant
- Patent Title: Method of forming thin film
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Application No.: US12219756Application Date: 2008-07-28
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Publication No.: US08383211B2Publication Date: 2013-02-26
- Inventor: Osamu Kasuga , Kei Hiruma
- Applicant: Osamu Kasuga , Kei Hiruma
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-196764 20040702
- Main IPC: G02F1/1337
- IPC: G02F1/1337
Abstract:
A method of forming a thin film includes: forming a thin film on a substrate by discharging liquid material as a droplet; discharging the liquid material to a liquid material disposing-region that is wider than a thin film forming region; and drying the liquid material thereby to dispose a raising portion at the edge of the thin film in the outside of the thin film forming region.
Public/Granted literature
- US20090035526A1 Method of forming thin film Public/Granted day:2009-02-05
Information query
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