发明授权
- 专利标题： Semiconductor package having an antenna with reduced area and method for fabricating the same
- 专利标题（中）： 具有减小面积的天线的半导体封装及其制造方法
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申请号： US13186713申请日： 2011-07-20
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公开(公告)号： US08383463B2公开(公告)日： 2013-02-26
- 发明人: Tae Min Kang
- 申请人： Tae Min Kang
- 申请人地址： KR Gyeonggi-do
- 专利权人： Hynix Semiconductor Inc.
- 当前专利权人： Hynix Semiconductor Inc.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Ladas & Parry LLP
- 优先权： KR10-2008-0125466 20081210; KR10-2009-0053185 20090616
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.