Invention Grant
- Patent Title: Solder ball contact susceptible to lower stress
- Patent Title (中): 焊球接触容易受到较低的应力
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Application No.: US13080105Application Date: 2011-04-05
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Publication No.: US08383505B2Publication Date: 2013-02-26
- Inventor: Luc Guerin , Mario J. Interrante , Michael J. Shapiro , Thuy Tran-Quinn , Van T. Truong
- Applicant: Luc Guerin , Mario J. Interrante , Michael J. Shapiro , Thuy Tran-Quinn , Van T. Truong
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Agent Catherine Ivers, Esq.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.
Public/Granted literature
- US20120256313A1 SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS Public/Granted day:2012-10-11
Information query
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