发明授权
- 专利标题： Solder ball contact susceptible to lower stress
- 专利标题（中）： 焊球接触容易受到较低的应力
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申请号： US13080105申请日： 2011-04-05
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公开(公告)号： US08383505B2公开(公告)日： 2013-02-26
- 发明人: Luc Guerin , Mario J. Interrante , Michael J. Shapiro , Thuy Tran-Quinn , Van T. Truong
- 申请人： Luc Guerin , Mario J. Interrante , Michael J. Shapiro , Thuy Tran-Quinn , Van T. Truong
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Gibb & Riley, LLC
- 代理商 Catherine Ivers, Esq.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.
公开/授权文献
- US20120256313A1 SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS 公开/授权日：2012-10-11
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