发明授权
US08383695B2 Phenoxy resin for optical material, resin composition for optical material, resin film for optical material and optical waveguide using those
失效
用于光学材料的苯氧树脂,用于光学材料的树脂组合物,用于光学材料的树脂膜和使用这些的光波导的光波导
- 专利标题: Phenoxy resin for optical material, resin composition for optical material, resin film for optical material and optical waveguide using those
- 专利标题(中): 用于光学材料的苯氧树脂,用于光学材料的树脂组合物,用于光学材料的树脂膜和使用这些的光波导的光波导
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申请号: US12282746申请日: 2007-03-15
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公开(公告)号: US08383695B2公开(公告)日: 2013-02-26
- 发明人: Tatsuya Makino , Atsushi Takahashi , Toshihiko Takasaki , Tomoaki Shibata , Masami Ochiai
- 申请人: Tatsuya Makino , Atsushi Takahashi , Toshihiko Takasaki , Tomoaki Shibata , Masami Ochiai
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2006-070702 20060315; JP2006-167408 20060616
- 国际申请: PCT/JP2007/055223 WO 20070315
- 国际公布: WO2007/105795 WO 20070920
- 主分类号: C08F2/50
- IPC分类号: C08F2/50 ; C08J3/28 ; G02B6/00
摘要:
The present invention relates to a phenoxy resin for an optical material obtained by subjecting at least one selected from specific difunctional epoxy resins and at least one selected from specific difunctional phenols to polyaddition reaction, wherein a film comprising the above phenoxy resin has a refractive index of 1.580 or less at 25° C. and a wavelength of 830 nm, a resin composition for an optical material containing the above phenoxy resin, a resin film for an optical material comprising the above resin composition and an optical waveguide produced by using the above resin composition and/or the above resin film. The present invention can provide a phenoxy resin for an optical material which is excellent in a heat resistance and a transparency and which has a low refractive index, a resin composition for an optical material containing the above phenoxy resin, a resin film for an optical material comprising the above resin composition and an optical waveguide produced by using the above resin composition and/or the above resin film.
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