Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13097104Application Date: 2011-04-29
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Publication No.: US08383955B2Publication Date: 2013-02-26
- Inventor: Tsung-Sheng Huang , Chun-Jen Chen , Duen-Yi Ho , Wei-Chieh Chou
- Applicant: Tsung-Sheng Huang , Chun-Jen Chen , Duen-Yi Ho , Wei-Chieh Chou
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW10110065A 20110324
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.
Public/Granted literature
- US20120241207A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-09-27
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