An enhanced withstand voltage micro switch includes a base and a cap covering the base. The cap has a press element movable up and down. The base has a conductive member depressed by the press element and a connecting section extended upwards. The base also includes a first contact, and a second contact extended from the connecting section and located above the first contact. The conductive member is swung during up and down movement of the press element to connect with the first or the second contact. The connecting section has an isolation portion jutting sideward between the first and second contacts to prevent generation of a conductive layer caused by connection of the conductive member with the first and second contacts on the connecting section. Thus secured insulation can be formed between the first and second contacts to withstand a higher voltage test.