Invention Grant
- Patent Title: Circuit carrier and semiconductor package using the same
- Patent Title (中): 电路载体和半导体封装使用相同
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Application No.: US12683613Application Date: 2010-01-07
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Publication No.: US08384204B2Publication Date: 2013-02-26
- Inventor: Chien Liu , Chih-Ming Chung
- Applicant: Chien Liu , Chih-Ming Chung
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: J.C. Patents
- Priority: TW98105657A 20090223
- Main IPC: H01L23/482
- IPC: H01L23/482 ; H05K1/09
Abstract:
A circuit carrier suitable for being connected with a bump is provided. The circuit carrier includes a substrate and at least one bonding pad. The substrate has a bonding pad disposed on a surface thereof for being connected with the bump. A brown-oxide layer is disposed on a surface of the bonding pad.
Public/Granted literature
- US20100213598A1 CIRCUIT CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2010-08-26
Information query
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