发明授权
- 专利标题： Electronic device package and method of manufacture
- 专利标题（中）： 电子器件封装及其制造方法
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申请号： US13174970申请日： 2011-07-01
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公开(公告)号： US08384205B2公开(公告)日： 2013-02-26
- 发明人: Qwai Low , Patrick Variot
- 申请人： Qwai Low , Patrick Variot
- 申请人地址： US CA Milpitas
- 专利权人： LSI Corporation
- 当前专利权人： LSI Corporation
- 当前专利权人地址： US CA Milpitas
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A method of manufacturing an electronic device package. Coating a first side of a metallic layer with a first insulating layer and coating a second opposite side of the metallic layer with a second insulating layer. Patterning the first insulating layer to expose bonding locations on the first side of the metallic layer, and patterning the second insulating layer such that remaining portions of the second insulating layer on the second opposite side are located directly opposite to the bonding locations on the first side. Selectively removing portions of the metallic layer that are not covered by the remaining portions of the second insulating layer on the second opposite side to form separated coplanar metallic layers. The separated coplanar metallic layers include the bonding locations. Selectively removing remaining portions of the second insulating layer thereby exposing second bonding locations on the second opposite sides of the separated coplanar metallic layers.
公开/授权文献
- US20110260324A1 ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE 公开/授权日：2011-10-27
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