Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US13053822Application Date: 2011-03-22
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Publication No.: US08384206B2Publication Date: 2013-02-26
- Inventor: Stephen St. Germain , Roger M. Arbuthnot , Frank Tim Jones
- Applicant: Stephen St. Germain , Roger M. Arbuthnot , Frank Tim Jones
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Robert F. Hightower
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
Public/Granted literature
- US20110169152A1 SEMICONDUCTOR PACKAGE Public/Granted day:2011-07-14
Information query
IPC分类:
