Invention Grant
- Patent Title: Thermal head, printer, and manufacturing method for the thermal head
- Patent Title (中): 热敏头，打印机和热头的制造方法
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Application No.: US12932125Application Date: 2011-02-17
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Publication No.: US08384749B2Publication Date: 2013-02-26
- Inventor: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2010-050450 20100308
- Main IPC: B41J2/335
- IPC: B41J2/335
Abstract:
A thermal head has a support substrate that has a concave portion having an opening portion formed in a surface of the support substrate, and an upper substrate bonded to the surface of the support substrate in a stacked state to close the opening portion. The upper substrate has an external dimension which is smaller than an external dimension of the support substrate and is slightly larger than an external dimension of the opening portion for closing the opening portion. A heating resistor is formed on a surface of the upper substrate in a position opposed to the concave portion of the support substrate. The thermal head is high in durability and reliability with increased printing efficiency as well as increased manufacturing yields.
Public/Granted literature
- US20110216147A1 Thermal head, printer, and manufacturing method for the thermal head Public/Granted day:2011-09-08
Information query
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