发明授权
US08385142B1 Flexible data strobe signal bus structure for wirebond and flip-chip packaging
有权
灵活的数据选通信号总线结构，用于引线键合和倒装芯片封装
- 专利标题： Flexible data strobe signal bus structure for wirebond and flip-chip packaging
- 专利标题（中）： 灵活的数据选通信号总线结构，用于引线键合和倒装芯片封装
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申请号： US12464783申请日： 2009-05-12
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公开(公告)号： US08385142B1公开(公告)日： 2013-02-26
- 发明人: Guu Lin , Yen-Fu Lin , Mark W. Fiester , Stephanie T. Tran
- 申请人： Guu Lin , Yen-Fu Lin , Mark W. Fiester , Stephanie T. Tran
- 申请人地址： US CA San Jose
- 专利权人： Altera Corporation
- 当前专利权人： Altera Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Womble Carlyle Sandridge & Rice, LLP
- 主分类号： G11C5/06
- IPC分类号： G11C5/06
摘要：
An integrated circuit with a flexible data strobe signal (DQS) bus structure is presented. The integrated circuit has a number of input/output (I/O) modules with a number of data pins to receive and transmit data. In addition, a subset of the I/O modules also have a data strobe pin. The input/output modules are connected to data strobe signal buses having a fixed configuration. The configuration of the fixed DQS bus groups a number of data pins with a corresponding data strobe pin and the grouping of data pin spans multiple I/O modules. The integrated circuit also has a flexible data bus connected to the I/O modules. Data pins of I/O modules of a second integrated circuit are mapped a subset of the data pins of corresponding I/O modules of the integrated circuit. The flexible data strobe signal bus enables selection of the subset of data pins in the integrated circuit.
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