Provided is a wiring board wherein a circuit is not short-circuited when a IC chip is mounted on the wiring board. A wiring board (2) is provided with a substrate (4); wiring layers (5-8), which are formed on a surface of the substrate (4) and have prescribed wiring patterns; connecting terminals (9-12), which are formed on a part of the wiring layers (5-8) and electrically connected with bumps (18-21) of an integrated circuit chip (IC chip) (3); a mounting region (14), which is arranged on the surface of the substrate (4) and has the integrated circuit chip (3) mounted therein; and an insulating layer (13), which is formed on the surface of the substrate (4) so as to surround the circumference of the mounting region (14) for protecting wiring layers (5-8). A part of the insulating layer (3) is arranged inside the mounting region (14), and the thickness of the insulating layer (13) is more than that of the bumps (18-21) of the integrated circuit chip (3).