- 专利标题: Internal frame optimized for stiffness and heat transfer
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申请号: US12859702申请日: 2010-08-19
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公开(公告)号: US08391010B2公开(公告)日: 2013-03-05
- 发明人: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- 申请人: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 代理机构: Womble Carlyle Sandridge & Rice LLP
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.
公开/授权文献
- US20120044635A1 INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER 公开/授权日:2012-02-23