A printed wiring board includes an insulating layer and a capacitor including a ceramic high dielectric layer being interposed between a first and a second electrode, and a semiconductor device mounting pad, including a first and a second pad, formed on an outermost resin insulating layer of the resin insulating layers. An underfill which covers an area larger than that of the high dielectric layer is formed, when the underfill covered area is projected along a lamination direction of the resin insulating layers to a face on which the high dielectric layer is formed. The capacitor is located immediately beneath the underfill covered area.