Invention Grant
- Patent Title: Modular integrated circuit with common software
- Patent Title (中): 具有通用软件的模块化集成电路
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Application No.: US12767201Application Date: 2010-04-26
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Publication No.: US08392696B2Publication Date: 2013-03-05
- Inventor: Lawrence J. Madar, III , Mark N. Fullerton , Bhupesh Kharwa
- Applicant: Lawrence J. Madar, III , Mark N. Fullerton , Bhupesh Kharwa
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Stuckman
- Main IPC: G06F9/24
- IPC: G06F9/24 ; G06F15/177

Abstract:
A modular integrated circuit includes a hub module that is coupled to a plurality of spoke modules via a plurality of hub interfaces. The spoke modules include a plurality of interface circuits each having a hardware address. A memory module stores the hub software and hub data and configuration data. The hub software includes a plurality of driver modules corresponding to the plurality of interface circuits. The processing module executes boot firmware to configure the plurality of driver modules based on the hardware address of each of the plurality of interface circuits.
Public/Granted literature
- US20110264901A1 MODULAR INTEGRATED CIRCUIT WITH COMMON SOFTWARE Public/Granted day:2011-10-27
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