发明授权
- 专利标题: Substrate laminating apparatus
- 专利标题(中): 基板层压装置
-
申请号: US11782014申请日: 2007-07-24
-
公开(公告)号: US08393370B2公开(公告)日: 2013-03-12
- 发明人: Masaru Mitsumoto , Shigeo Watanabe , Tatsuhito Kunihiro
- 申请人: Masaru Mitsumoto , Shigeo Watanabe , Tatsuhito Kunihiro
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Plant Technologies, Ltd.
- 当前专利权人: Hitachi Plant Technologies, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2006-200172 20060724
- 主分类号: B29C65/00
- IPC分类号: B29C65/00
摘要:
A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.
公开/授权文献
- US20080017322A1 SUBSTRATE LAMINATING APPARATUS 公开/授权日:2008-01-24
信息查询