Invention Grant
- Patent Title: Ejector device of injection molding machine
- Patent Title (中): 注塑机喷射装置
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Application No.: US12924575Application Date: 2010-09-30
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Publication No.: US08393884B2Publication Date: 2013-03-12
- Inventor: Seiji Kimura
- Applicant: Seiji Kimura
- Applicant Address: JP Hyogo
- Assignee: Pascal Engineering Corporation
- Current Assignee: Pascal Engineering Corporation
- Current Assignee Address: JP Hyogo
- Agency: Jordan and Hamburg LLP
- Main IPC: B29C45/40
- IPC: B29C45/40

Abstract:
The ejector device of a molding machine includes: an ejector plate; an ejector drive means for driving the ejector plate in directions to approach towards and to withdraw from a platen; a plurality of rod insertion holes formed so as to pierce through the platen; and a plurality of ejector rods or a plurality of base rods which are base end portions of ejector rods that are inserted into the plurality of rod insertion holes so as to slide freely therein; and a plurality of magnetic rod fixing mechanisms capable of removably fixing the plurality of ejector rods to the ejector plate, or of removably fixing the plurality of detachable rods to the tip end portions of the base rods which are fixed to the ejector plate.
Public/Granted literature
- US20110311665A1 Ejector device of injection molding machine Public/Granted day:2011-12-22
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