Invention Grant
- Patent Title: Formulations for environmentally friendly photoresist film layers
- Patent Title (中): 环保光致抗蚀剂膜层的配方
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Application No.: US12894930Application Date: 2010-09-30
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Publication No.: US08394575B2Publication Date: 2013-03-12
- Inventor: Xiaoming Wu , David Graham , Sean Weaver , Bart Mansdorf , Rich Wells , Joel Provence
- Applicant: Xiaoming Wu , David Graham , Sean Weaver , Bart Mansdorf , Rich Wells , Joel Provence
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: G03F7/004
- IPC: G03F7/004

Abstract:
Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.
Public/Granted literature
- US20120082933A1 FORMULATIONS FOR ENVIRONMENTALLY FRIENDLY PHOTORESIST FILM LAYERS Public/Granted day:2012-04-05
Information query
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