发明授权
- 专利标题: Electromagnetic wave shielding material, and method for manufacturing same
- 专利标题(中): 电磁波屏蔽材料及其制造方法
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申请号: US12923186申请日: 2010-09-08
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公开(公告)号: US08395059B2公开(公告)日: 2013-03-12
- 发明人: Yuichi Miyazaki , Yuusuke Satou , Shinya Kiura , Yukihiro Kyouden , Yusuke Hagiwara , Takeshi Nisizono , Takeaki Imaizumi
- 申请人: Yuichi Miyazaki , Yuusuke Satou , Shinya Kiura , Yukihiro Kyouden , Yusuke Hagiwara , Takeshi Nisizono , Takeaki Imaizumi
- 申请人地址: JP Tokyo
- 专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2008-307790 20081202; JP2009-124582 20090522; JP2009-260316 20091113
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same. The electromagnetic wave shielding material and the method for manufacturing the same include a configuration capable of achieving a lower surface resistivity in an electromagnetic wave shielding material which is required to achieve a much more reduction in a line width of the pattern, specifically, a reduction to a line width of not more than 30 μm, and more preferably not more than 15 to 20 μm and a treatment method capable of reducing the surface resistivity by an easy and short-time treatment.
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