Invention Grant
US08398208B2 Ceramic printed circuit board (PCB) and inkjet printhead assembly using the same
有权
陶瓷印刷电路板(PCB)和喷墨打印头组件使用相同
- Patent Title: Ceramic printed circuit board (PCB) and inkjet printhead assembly using the same
- Patent Title (中): 陶瓷印刷电路板(PCB)和喷墨打印头组件使用相同
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Application No.: US12354838Application Date: 2009-01-16
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Publication No.: US08398208B2Publication Date: 2013-03-19
- Inventor: Jun-ho Lee , Seong-nam Jeon
- Applicant: Jun-ho Lee , Seong-nam Jeon
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2008-0066011 20080708
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A ceramic printed circuit board (PCB) and an inkjet printhead assembly using the ceramic PCB. A ceramic PCB in which a plurality of layers are stacked includes a plurality of terminals to receive an electric signal from an external source, a plurality of circuit patterns connected to the plurality of terminals to transmit the electric signal, and a termination resistor having a predetermined thickness disposed between the plurality of circuit patterns, wherein the termination resistor is mounted between the plurality of stacked layers.
Public/Granted literature
- US20100007701A1 CERAMIC PRINTED CIRCUIT BOARD (PCB) AND INKJET PRINTHEAD ASSEMBLY USING THE SAME Public/Granted day:2010-01-14
Information query
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