发明授权
- 专利标题： Airgap micro-spring interconnect with bonded underfill seal
- 专利标题（中）： 气隙微弹簧互连带粘合底部填充密封
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申请号： US13269609申请日： 2011-10-09
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公开(公告)号： US08399296B2公开(公告)日： 2013-03-19
- 发明人: Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
- 申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
- 申请人地址： US CA Palo Alto
- 专利权人： Palo Alto Research Center Incorporated
- 当前专利权人： Palo Alto Research Center Incorporated
- 当前专利权人地址： US CA Palo Alto
- 代理机构： Marger Johnson & McCollom PC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/34
摘要：
A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.