发明授权
- 专利标题: Semiconductor device and manufacturing method of same
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13283264申请日: 2011-10-27
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公开(公告)号: US08399926B2公开(公告)日: 2013-03-19
- 发明人: Masumi Saitoh , Ken Uchida
- 申请人: Masumi Saitoh , Ken Uchida
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2008-085905 20080328
- 主分类号: H01L27/12
- IPC分类号: H01L27/12
摘要:
A FinFET and nanowire transistor with strain direction optimized in accordance with the sideface orientation and carrier polarity and an SMT-introduced manufacturing method for achieving the same are provided. A semiconductor device includes a pMISFET having a semiconductor substrate, a rectangular solid-shaped semiconductor layer formed at upper part of the substrate to have a top surface parallel to a principal plane of the substrate and a sideface with a (100) plane perpendicular to the substrate's principal plane, a channel region formed in the rectangular semiconductor layer, a gate insulating film formed at least on the sideface of the rectangular layer, a gate electrode on the gate insulator film, and source/drain regions formed in the rectangular semiconductor layer to interpose the channel region therebetween. The channel region is applied a compressive strain in the perpendicular direction to the substrate principal plane. A manufacturing method of the device is also disclosed.
公开/授权文献
- US20120037994A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME 公开/授权日:2012-02-16