发明授权
US08399983B1 Semiconductor assembly with integrated circuit and companion device
有权
具有集成电路和配套器件的半导体组件
- 专利标题： Semiconductor assembly with integrated circuit and companion device
- 专利标题（中）： 具有集成电路和配套器件的半导体组件
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申请号： US12332505申请日： 2008-12-11
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公开(公告)号： US08399983B1公开(公告)日： 2013-03-19
- 发明人: Bernard J. New
- 申请人： Bernard J. New
- 申请人地址： US CA San Jose
- 专利权人： Xilinx, Inc.
- 当前专利权人： Xilinx, Inc.
- 当前专利权人地址： US CA San Jose
- 代理商 Robert M. Brush; Kin-Wah Tong; LeRoy D. Maunu
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
A semiconductor assembly with an integrated circuit (IC) and a companion device. An exemplary semiconductor assembly includes a printed circuit board (PCB) and first and second ICs. The PCB has first contacts on a top surface and second contacts on a bottom surface. The first contacts are vertically aligned with the second contacts and are electrically coupled by vias in the PCB. The first IC has first terminals respectively coupled to the first contacts of the PCB, the first terminals including first input/output (IO) terminals. The second IC includes at least one die, and second terminals coupled to at least a portion of the second contacts of the PCB. The second terminals include second IO terminals of the companion die, and are respectively coupled to those of the second contacts that are vertically aligned with those of the first contacts respectively coupled to the first IO terminals.
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