Invention Grant
- Patent Title: High-frequency module and communication apparatus using the module
- Patent Title (中): 高频模块和使用该模块的通信设备
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Application No.: US12356731Application Date: 2009-01-21
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Publication No.: US08401495B2Publication Date: 2013-03-19
- Inventor: Masashi Hayakawa
- Applicant: Masashi Hayakawa
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.; John F. Guay
- Priority: JP2006-202337 20060725
- Main IPC: H04B1/44
- IPC: H04B1/44

Abstract:
A high-frequency module has a configuration in which a diplexer is capable of separating the frequency bands of first and second communication systems from the frequency band of a third communication system, a first high-frequency switch is capable of separating a transmission signal of the first or second communication system from a reception signal thereof, a second high-frequency switch is capable of separating a transmission signal of the third communication system from a reception signal thereof, and a third high-frequency switch is capable of separating the reception signal of the first communication system from the reception signal of the second communication system. A reception-signal output port for the second communication system of the high-frequency module is terminated with a chip capacitor to configure the double-band high-frequency module supporting the first and third communication systems.
Public/Granted literature
- US20090185512A1 HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS USING THE MODULE Public/Granted day:2009-07-23
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