Invention Grant
- Patent Title: Rapid two/three-dimensional sector strain imaging
- Patent Title (中): 快速二维/三维扇区应变成像
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Application No.: US12054830Application Date: 2008-03-25
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Publication No.: US08403850B2Publication Date: 2013-03-26
- Inventor: Tomy Varghese , Hao Chen
- Applicant: Tomy Varghese , Hao Chen
- Applicant Address: US WI Madison
- Assignee: Wisconsin Alumni Research Foundation
- Current Assignee: Wisconsin Alumni Research Foundation
- Current Assignee Address: US WI Madison
- Agency: Boyle Fredrickson S.C.
- Main IPC: A61B8/00
- IPC: A61B8/00
Abstract:
An elastographic imaging system providing for axial, lateral and elevational strain measurements employs a series of one-dimensional axial measurements to deduce a coarse axial, lateral and/or elevational displacement that is used to guide one or more, two- or three-dimensional cross-correlations of smaller kernels providing improved image resolution.
Public/Granted literature
- US20090247871A1 RAPID TWO/THREE-DIMENSIONAL SECTOR STRAIN IMAGING Public/Granted day:2009-10-01
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