Invention Grant
- Patent Title: Photosensitive composition, and pattern-forming method and resist film using the photosensitive composition
- Patent Title (中): 光敏组合物，图案形成方法和使用光敏组合物的抗蚀剂膜
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Application No.: US12786127Application Date: 2010-05-24
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Publication No.: US08404427B2Publication Date: 2013-03-26
- Inventor: Kenji Wada , Kunihiko Kodama
- Applicant: Kenji Wada , Kunihiko Kodama
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-379028 20051228
- Main IPC: G03F7/028
- IPC: G03F7/028 ; G03F7/039 ; G03F7/26
Abstract:
A photosensitive composition containing a compound having a specific structure, a pattern-forming method using the photosensitive composition, and a compound having a specific structure used in the photosensitive composition.
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