发明授权
US08404592B2 Methods for fabricating FinFET semiconductor devices using L-shaped spacers
有权
使用L形间隔物制造FinFET半导体器件的方法
- 专利标题: Methods for fabricating FinFET semiconductor devices using L-shaped spacers
- 专利标题(中): 使用L形间隔物制造FinFET半导体器件的方法
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申请号: US12509918申请日: 2009-07-27
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公开(公告)号: US08404592B2公开(公告)日: 2013-03-26
- 发明人: Scott Luning , Frank S. Johnson
- 申请人: Scott Luning , Frank S. Johnson
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES, Inc.
- 当前专利权人: GLOBALFOUNDRIES, Inc.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: Ingrassia Fisher & Lorenz, P.C.
- 主分类号: H01L21/302
- IPC分类号: H01L21/302
摘要:
Methods for fabricating semiconductor structures, such as fin structures of FinFET transistors, are provided. In one embodiment, a method comprises providing a semiconductor substrate and forming a plurality of mandrels overlying the semiconductor substrate. Each of the mandrels has sidewalls. L-shaped spacers are formed about the sidewalls of the mandrels. Each L-shaped spacer comprises a rectangular portion disposed at a base of a mandrel and an orthogonal portion extending from the rectangular portion. Each L-shaped spacer also has a spacer width. The orthogonal portions are removed from each of the L-shaped spacers leaving at least a portion of the rectangular portions. The semiconductor substrate is etched to form fin structures, each fin structure having a width substantially equal to the spacer width.
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