发明授权
- 专利标题： Electronic-component-housing package and electronic device
- 专利标题（中）： 电子元器件封装和电子元器件
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申请号： US12602461申请日： 2008-03-27
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公开(公告)号： US08405200B2公开(公告)日： 2013-03-26
- 发明人: Yoshiaki Ueda
- 申请人： Yoshiaki Ueda
- 申请人地址： JP Kyoto
- 专利权人： Kyocera Corporation
- 当前专利权人： Kyocera Corporation
- 当前专利权人地址： JP Kyoto
- 代理机构： DLA Piper LLP (US)
- 优先权： JP2007-142125 20070529; JP2007-307969 20071128
- 国际申请： PCT/JP2008/055929 WO 20080327
- 国际公布： WO2008/146531 WO 20081204
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic-component-housing package comprises a container including a rectangular mount on which an electronic component is to be mounted and a sidewall surrounding the mount. The electronic-component-housing package comprises a lead terminal extending from an inside of a space enclosed by the sidewall to an outside of the space. A tip part of the lead terminal is extending along one side of the mount.
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