Invention Grant
- Patent Title: Housing for electronic device
- Patent Title (中): 电子设备外壳
-
Application No.: US12637901Application Date: 2009-12-15
-
Publication No.: US08406832B2Publication Date: 2013-03-26
- Inventor: De-Zhi Ye
- Applicant: De-Zhi Ye
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200910301324 20090402
- Main IPC: H04M1/00
- IPC: H04M1/00
Abstract:
A housing for an electronic device comprises a substrate, a base coat, and a transparent top coat. The substrate is a transparent or a translucent plastic substrate and has opposite surfaces. The base coat and the top coat are respectively formed on the opposite surfaces of the substrate.
Public/Granted literature
- US20100254075A1 HOUSING FOR ELECTRONIC DEVICE Public/Granted day:2010-10-07
Information query
