An inductive plasma chamber of the present invention comprises a plurality of discharge tube bridges connected between a discharge tube head and a process chamber. The discharge tube head is disc shaped and a cylindrical gas inlet which a gas is injected is disposed in its center. A susceptor on which a workpiece is placed is disposed inside a process chamber and a flange of upper certain area has an inclined surface which is upward centrally inclined. The discharge tube bridge is provided with at least one ferrite core, and the ferrite core has a winding connected to a power supply source. When a process gas is injected via the gas inlet and a RF power from the power supply source is supplied with a winding, the electromotive force is transmitted inside the discharge tube head, the discharge bridge and the process chamber so that the plasma discharge is occurred in the plasma chamber. The plasma chamber comprises a switching means enabling plasma discharge paths to be alternately formed between the plurality of discharge tube bridges. The switching means switches in a predetermined period to be alternately formed the plasma discharge paths between the plurality of discharge tube bridges. The inductive plasma chamber can obtain high-density plasma while enhancing uniformity as well as enlarging plasma volume.