发明授权
- 专利标题： Separation apparatus, separation method, and method for manufacturing semiconductor element
- 专利标题（中）： 分离装置，分离方法以及半导体元件的制造方法
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申请号： US13168059申请日： 2011-06-24
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公开(公告)号： US08409973B2公开(公告)日： 2013-04-02
- 发明人: Akihiro Chida , Kaoru Hatano
- 申请人： Akihiro Chida , Kaoru Hatano
- 申请人地址： JP
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Husch Blackwell LLP
- 优先权： JP2010-145260 20100625
- 主分类号： H01L21/304
- IPC分类号： H01L21/304
摘要：
Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.
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