发明授权
- 专利标题： Skin wound healing compositions and methods of use thereof
- 专利标题（中）： 皮肤伤口愈合组合物及其使用方法
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申请号： US13210200申请日： 2011-08-15
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公开(公告)号： US08410055B2公开(公告)日： 2013-04-02
- 发明人: Wei Li , Mei Chen , David T. Woodley
- 申请人： Wei Li , Mei Chen , David T. Woodley
- 申请人地址： US CA Los Angeles
- 专利权人： University of Southern California
- 当前专利权人： University of Southern California
- 当前专利权人地址： US CA Los Angeles
- 代理机构： McDermott Will & Emery LLP
- 主分类号： A61K38/00
- IPC分类号： A61K38/00 ; A61K45/00 ; A61P43/00
摘要：
A wound healing composition comprising an amount of heat shock protein effective to promote wound healing and a method thereof to apply the composition. A preferred heat shock protein is either full-length hsp90α or the middle domain plus the charged sequence of hsp90α. The composition is topically applied to skin wounds, covering the outer surface of the wound. The heat shock protein acts by promoting migration of both human epidermal keratinocyte and dermal fibroblasts to the wound in order to close, heal, and remodel the wound.
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