Invention Grant
US08410465B2 Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor
失效
使用激光和非接触式电容传感器来检查形成在基板上的电路图案的缺陷的装置和方法
- Patent Title: Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor
- Patent Title (中): 使用激光和非接触式电容传感器来检查形成在基板上的电路图案的缺陷的装置和方法
-
Application No.: US12716948Application Date: 2010-03-03
-
Publication No.: US08410465B2Publication Date: 2013-04-02
- Inventor: Seung Seoup Lee , Jae Cheon Doh , In Kyung Park
- Applicant: Seung Seoup Lee , Jae Cheon Doh , In Kyung Park
- Applicant Address: KR Suwon, Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-do
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: KR10-2009-0118701 20091202
- Main IPC: G01N21/86
- IPC: G01N21/86
Abstract:
An apparatus for inspecting defects in a circuit pattern is described. The apparatus includes at least one laser unit for radiating a laser beam onto a first end of a circuit pattern formed on a substrate. The apparatus also includes a capacitor sensor disposed opposite a second end of the circuit pattern, which is connected to the first end of the circuit pattern through a via hole, in a non-contact manner. The apparatus also includes a voltage source connected to the capacitor sensor and configured to apply a voltage. The apparatus also includes a measurement unit connected to the capacitor sensor and configured to detect variation in impedance generated in the capacitor sensor.
Public/Granted literature
- US20110128011A1 APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN Public/Granted day:2011-06-02
Information query
